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RT1616-EMI Vacuum Metalizing Machine is specially designed for EMI shielding thin film deposition which widely used in telecommunication devices, computers, notebooks, consumer electronics, home appliance, aerospace and military items. Materials commonly used in PVD EMI shielding films.

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Background

Why EMI shielding film deposition by PVD?

EMI (Electromagnetic Interference) shielding using PVD (Physical Vapor Deposition) has several advantages that make it a popular choice for various applications:

  1. High Shielding Effectiveness: PVD processes allow for the deposition of thin films of conductive materials with precise control over thickness and uniformity, providing excellent shielding effectiveness against electromagnetic interference.

  2. Customization: PVD offers flexibility in choosing different materials for the shielding film based on the specific requirements of the application, such as conductivity, corrosion resistance, and cost.

  3. Uniform Deposition: PVD ensures uniform coverage of the substrate, which is crucial for achieving consistent shielding performance across the entire surface.

  4. Thin and Lightweight Films: PVD EMI shielding films can be deposited in thin layers, maintaining the overall weight and thickness of the device or substrate while still providing effective electromagnetic interference protection.

  5. Compatibility with Various Substrates: PVD processes are compatible with a wide range of substrates, including plastics, glass, ceramics, and metals, making it suitable for diverse applications in electronics, aerospace, automotive, and more.

  6. Durability and Reliability: PVD coatings are known for their durability, wear resistance, and long-term stability, ensuring that the EMI shielding remains effective over the lifespan of the device.

  7. Cost-Effective Production: PVD processes can be scaled for high-volume production, making them a cost-effective choice for manufacturing EMI shielding films in industries where large quantities are required.

  8. Environmental Benefits: PVD is a clean and environmentally friendly process that produces minimal waste and does not involve harmful chemicals, making it a sustainable choice for EMI shielding applications.

Overall, EMI shielding by PVD offers a combination of performance, flexibility, and cost-effectiveness, making it a preferred method for protecting electronic devices and components from electromagnetic interference.

EMI coating metal materials:

Aluminum: Provides good conductivity and is lightweight.
Copper: Offers excellent conductivity and high shielding effectiveness.
Silver: Known for its high conductivity but can be more expensive.
Gold: Highly conductive and corrosion-resistant, often used for specialized applications.
Alloys:
Nickel alloys: Offer a balance between cost and performance.
Tin alloys: Can provide a good compromise between conductivity and cost.
Steel alloys: Used in applications where strength is important along with shielding properties.
Metal Composites:
Metal matrix composites: These may combine metals with ceramics or other materials to improve specific properties.
Other Materials:
Graphene: Known for its excellent electrical conductivity and mechanical strength.
Carbon nanotubes: Provide good electrical conductivity and are lightweight.
The choice of material depends on factors such as the required level of shielding effectiveness, cost considerations, substrate compatibility, and specific application requirements. Each material has its own set of advantages and limitations in terms of conductivity, flexibility, weight, and cost.

Applications

Electro Magnetic Interference (EMI)Shielding Metalizer Applications:

Electronic Industry like cell phone case, laptop cases, radar speed measurement instruments, car video components etc.
Other Industries Need Electric Magnetic Interference Shielding Function

Substrate Materials: ABS, PC, PC+ABS, Plastic Etc.

EMI Shielding Film Properties

  1. Film thickness : 1.5 ~ 3 microns depends on the requirement.
  2. Film resistance: (ohm) better than 0.5Ω
  3. Adhesion: 3M810 tape > 5B

EMI shielding film coating process

  1. DC Sputtering Stainless Steel
  2. Copper deposition by Thermal Evaporation
  3. DC Sputtering Stainless Steel, full cover on Cu film layer.

EMI Shielding Coatings by PVD vacuum solution

EMI shielding coated samples

Technical advantages

Advantages

Finishes are deposited using an environmentally friendly green process, pollution free;
High Efficiency
Excellent uniformity.
High volume production
Low cost, ideal solution for mass production demand
High Yield, up to 98%
Thickness can be controlled

Design Features

1) 2-door structure and fast pumping speed for a high productivity
2) Operating friendly touch screen panel with PLC control
3)Humanity friendly software program design for stable production and high quality.
4) High sputtering target utilization rate ensure a low production cost.
5) Good uniformity & Excellent adhesion
6) Advanced design concept for a better performance to enhance production efficiency and qualified rate.
7) Ion source device for plasma cleaning and surface activity treatment to improve adhesion.
8) High-vacuum pumping time cut by 25% to 75%  by Polycold – water vapor cryopump.

Polycold also named as Water Vapor Cryopump, effectively captures water vapor which comprises 65% to 95% of the residual gas in Hi-vac systems. Water vapor is typically the most reactive contamination present With Polycold, you can expect to increase product throughput in your existing system 20% to 100% and improve quality of deposition.

  1. High-vacuum pumping time cut by 25% to 75%
  2. Increased product throughput of 20% to 100%;
  3. Typical payback times of less than one year;
  4. Lower water vapor partial pressure during processing for higher film quality, better adhesion and more reproducible depos
Technical specifications

RT1616-EMI  PVD vacuum metallization system specifications

Type:

  • Vertical orientation, Cylinder, 2-doors structure, front opening.

Technical Specifications:

  • Performance
  1. Ultimate Vacuum Pressure: better than 5.0×10-6Torr.
  2. Operating Vacuum Pressure: 1.0×10-4Torr
  3. Pumping down Time: from 1 atm to 1.0×10-4Torr≤5 minutes ( room temperature, dry, clean and empty chamber)
  4. Metalizing material ( evaporation): Stainless Steel, Copper
  5. Operating Model: Full Automatically /Semi-Auto/ Manually
  • Structure

The vacuum coating machine contains key completed system listed below:

  1. Vacuum Chamber

1.1 Size: Inner Diameter 1600mm

Inner Height: 1600mm

Useful Height: 1265mm

Total Height: 1420mm

1.2 Materials: Vacuum Chamber SUS304

Door and flanges SUS304

Chamber strengthen structure: SS41 mild steel, with painted finishing surface treatment.

Chamber chassis SS41 mild steel with painted finishing surface treatment.

1.3 Sputtering and Evaporation Shield : SUS304

1.4 View Window: on chamber doors

1.5 Vacuum Chamber Venting Valve (including silencer)

1.6 Door: SUS304 material Diameter 1600mm Inner Height: 1600mm

1.7 Deposition Driving System: Central driving max. 1400mm*1265mm

1.8 Driving Motor: 1/2HP

1.9 Evaporation Power: 1 set/door

DC Sputtering Power: 1 set

Sputtering Cathode size: 125*1400mm

  1. Roughing Vacuum Pumping System

2.1 Oil sealed Rotary Vane Vacuum Pump – Leybold

a: Pumping speed: 640 m3/hr

2.2 Roots Pump – Leybold

a: Pumping speed:4400 m3/hr

2.3 Roughing Vacuum Valve: pneumatic model

2.4 Vacuum Piping Line: 6” & 8” SUS304 material

2.5 Vacuum Venting Valve: 3/8” electromagnetic model

  1. High Vacuum Pumping System

3.1 Oil diffusion pump: RTDP-36

  1. Pumping speed: 40000L/S
  2. Ultimate Vacuum Pressure: better than 10-7Torr.
  3. Heating Power: 3Phase, 21KW.
  4. Oil consumption: 9 liters

3.2 Cold trap: 36” , water cooling against oil stream back

3.3 High Vacuum Valve: pneumatic

3.4 Fore-line Valve: pneumatic

  1. Electrical Control and Operation System

4.1 Main circuit: None-fuse breaker switch, electromagnetic switch,
C/T in series type

4.2 Evaporation Power

4.3 Evaporation Control System

4.4 Sputtering Power, DC model

4.5 Control System: PLC +Touch Screen Auto/Manually

4.6 Operation System: Touch Screen + Display

4.7 Vacuum Pressure Measuring System

Vacuum Gauge: Leybold Center Two – 1 set

Full Range Gauge: 760 Torr ~ 10-7 Torr – 1 set

4.8 Alarm System:

Compressed air pressure is lower: alarm sound

Cooling water flow is lower: alarm sound

Mis-operation: alarm sound

4.9 Power Load Indicator: Voltage indicator and load current indicator

  1. Sub-System

5.1 Air Compressed Valve Control System

5.2 Cooling Water System: Water flow pipe and switch valve system

5.3 Polycold (-120~-145℃) Cryopump – 1 set

Model: MaxCool- 2500L

Maximum load:: 2500W

Pumping speed: 14000L/S.

  1. Deposition System

6.1 Sputtering Source

  1. Sputtering Target” 125mm*1400mm* 12~14mm – 1 set
  2. Shutter – 1 set
  3. Mass Flow Controller: Ar gas – 1 set
  4. Sputtering Power Supply: DC 60KW – 1 set

6.2 Evaporation Sources

  1. Tungsten evaporation sources
  2. Evaporation Power Supply: 20kVA
  3. Ion source device and power supply

Working Environment

Compressed Air: 5~8kg/cm2

Cooling Water: Water-In Temperature: 20~25℃, 200 Liter/min,
Water-In Pressure: 2~3 kg/cm2

Power: 3 Phase 380V 50Hz(60Hz), 160kVA

Installation Area: (L*W*H) 6500*5500*2700mm

Exhaust: Vent for mechanical pumps

We have been endeavored to design and develop the most suitable coating processes for different 3D parts, which meet our customer production requirements. So we provide total coating solutions for EMI coating.

If customized coating system is required, please share your thoughts and ideas with our team and submit your products specifications, we will work together to sort out the best solutions.

Layout

Please contact us for more specifications, Royal Technology is honored to provide you total coating solution.

In-site

Location: China (Tianjin， Qingdao, Jiangsu,Hangzhou etc.)



 E-catalogue for online review and download.

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