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ROYAL Technology supplies turnkey coating solutions for manufactures who are looking for a reliable team for long term cooperation. Robust design, large batches, fast cycle, flexible coating processes are the basic design concepts ROYAL Team has been pursuing.

Background

Why PVD Gold Sputtering Deposition?

PVD (Physical Vapor Deposition) gold sputtering is a process that involves depositing a thin film of gold onto a substrate using a sputtering technique. In this process, gold atoms are ejected from a solid gold target source through bombardment with energetic ions, typically argon ions, in a vacuum environment. These gold atoms travel to the substrate and form a thin, uniform layer on its surface.
Here are some key points about PVD gold sputtering:
High Purity Deposition: PVD gold sputtering allows for the deposition of high-purity gold films without the need for additional chemicals or solvents, making it a clean and efficient process.
Controlled Thickness: The thickness of the gold film can be precisely controlled by adjusting parameters such as sputtering time, power, and deposition rate, ensuring uniformity and consistency across the substrate.
Adhesion: PVD gold sputtering provides good adhesion of the gold film to the substrate, resulting in a durable and long-lasting coating.
Conformal Coating: The sputtering process enables the deposition of gold films on complex shapes and surfaces with high conformality, ensuring coverage even on intricate geometries.
Optical Properties: Gold films deposited by PVD sputtering exhibit unique optical properties, such as high reflectivity in the visible and near-infrared spectrum, making them suitable for applications in optics, mirrors, and decorative coatings.
Electrical Conductivity: Gold is an excellent conductor of electricity, and gold films deposited through PVD sputtering maintain this conductivity, making them suitable for applications in electronics and semiconductor industries.
Corrosion Resistance: Gold is highly resistant to corrosion, providing protection to the underlying substrate and ensuring long-term stability of the coated surface.

Applications

PVD Functional Coatings- Gold Sputtering Thin Film Deposition System

Gold has a bright, reddish-yellow color in its purest form. It does not oxidize in the air at room temperature, so it remains very stable under normal conditions and its electrical conductivity is constant. It is one of the most common precious metals used in finishing.

Gold is corrosion resistant, which makes it a good finish for connector pins and electrical switch contacts.

Gold plating is used in parts and components across a wide range of main industries:

  1. Medical applications: body implants
  2. Energy: hydrogen fuel cell Bipolar plates
  3. Semiconductor: microelectronic chips
  4. Aerospace & defense
  5. Telecommunications and other more

Nylon textile                                                 Micro-electronic industry

Medical Industry Medical Industry

Technical advantages

Design Advantages

  1. Energy saving: compact design and molecular pumps are applied
  2. High target utilization up to 40% with planar sputtering cathode
  3. Sputtered Au gold film’s thickness is controllable
  4. One-Touch operation system

PVD Gold sputtering deposition

  1. When comes to glass, metal alloys etc. Substrates material, the bonding layer is essential to enhance substrate and Aufilm adhesion. Royal Technology has developed a range of matured coating recipes based on different applications, support our customers with professional advice.
  2. The roughness (RMS – root mean square) < 40? is expected for most of the applications. For certain scanning probe applications a lower roughness might be required, generally 1.5 ~ 4 nm.
  3. Gold sputtering layer surface purity: a clean surface is required for applications that employ gold surface modifications. Depending on the PVD process used, level of vacuum in the system, original purity of the gold source (over 99.99% generally)

Please contact us for more information, we are always open to communicate and share with you the advanced techniques.

Technical specifications

Technical Specifications:

MODEL: RTSP800

TECHNOLOGY: DC Sputtering + Ion source (for option)

MATERIAL: Stainless Steel

CHAMBER SIZE: Φ800*H800mm

CHAMBER TYPE: Cylinder, vertical, 1-door

ROTARY RACK SYSTEM: Planetary/Central driving

DEPOSITION MATERIAL: Gold, Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium

DEPOSITION SOURCE: Planar Sputtering Cathodes,

Conventional arc cathodes for option(according to the coating process’s requirement)

REACTIVE GAS CONTROL: MFC, 2/4 ways

CONTROL PLC(Programmable Logic Controller) +IPC

PUMP SYSTEM:
SV300B – 1 set (Leybold) 300m3/hr

Roots Pump – 1 set, 490m3/hr

Holding Pump – 1 set, 60m3/hr

Turbo Molecular Pump: – 1 set, 3500L/S

POWER SUPPLY: Bias power supply: 1*24 KW

DC sputtering power: 12KW

Linear Ion source: 5KW

SAFETY SYSTEM:Numerous safety interlocks to protect operators and equipment

COOLING Recycle: Cooling Water

HEATING: Heaters, 9KW

POWER ELECTRICAL:
480V/3 phases/60HZ ( USA compliant)

460V/3 phases/50HZ ( Asia compliant)

380V/3 phases/50HZ ( EU-CE compliant)

FOOTPRINT: L3200*W2600*H2000mm

TOTAL WEIGHT: 4.0 T

CYCLE TIME: 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions)

POWER MAX: 50KW

AVERAGE POWER CONSUMPTION (APPROX.): 20KW