Magnetron Sputtering Deposition Machine

Principle: Magnetron sputtering is a physical vapor deposition technique where material from a target is ejected onto a substrate to create a thin film coating. In this process, a plasma is formed in a vacuum chamber, and ions from the plasma bombard the target material, causing atoms to be ejected and deposited onto the substrate.

Components:

Vacuum Chamber: The machine consists of a vacuum chamber where the sputtering process takes place under controlled pressure conditions.

Target Material: The material to be deposited (e.g., metal or alloy) is placed as a target inside the chamber.

Substrate Holder: The substrate to be coated is positioned facing the target material.

Magnetron Source: A magnetron source is used to create a magnetic field that enhances the sputtering process, increasing the efficiency of material deposition.

Operation:

Sputtering: Gas ions (typically argon) are introduced into the chamber, creating a plasma discharge. The ions strike the target material, dislodging atoms or molecules.

Deposition: The ejected material from the target condenses on the substrate, forming a thin film coating.

Control Parameters: Parameters such as gas pressure, power supply voltage, and deposition time are controlled to achieve the desired film thickness, composition, and properties.

Royal Technology FCEV1200

Bipolar Plate Coating Equipment For Hydrogen FCEV

The core technique  is how to generate the electrical energy with fuel cell power modules through electrochemical reaction between hydrogen as fuel and oxygen. Scientists, engineers, professors from transportation organizations and worldwide vehicle manufactures have made thousands of tests and finally developed the proper processing.

The machine is the first batch model plant for industrial production we provided.

Coating Films: DLC,  Carbon-based metal film,  24K Au gold deposition

Performance:
To improve the conductivity of surface;
High corrosion resistance;
High wear resistance;
High hardness
Hydrophobic composition film and other functional films
Available for compound coatings: metallic and non-metallic films.
Film thickness range from 100nm to 12μm, thickness tolerance ±5%
Strong adhesion.
Low tempering parts surface hardening treatment.

Structure:

Vertical orientation, octagonal structure, 2 doors opening (front and back) for easy access.

Features:

• Environmentally friendly system, no hazardous waste
• Integrated, modular design
• Commercialized and standardized for industrial mass production
• Extremely efficient ion source for strong adhesion and high ionization
• Easy Operation: Touch screen + PLC control, one touch operation
• With Royal Technology’s software, process parameters can be programmed, saved and reproduced
• Special design of Carousel system for highly uniform deposition
• High productivity and stability, working 24/7 a week
• Flexible, matches various sizes of plates, for single or double sides coating

Linear Ion Source device for Plasma Etching and Plasma Assisted Deposition, which has advanced performance:

1) Pre-cleaning, the plasma etching process operated in a high vacuum  environment, to avoid the work pieces’ 2nd-time contamination.
2) To enhance the adhesion between substrate and coating films
3) Assistance Deposition during coating, improve the uniformity.