The RTSP1200-PCB machine is a tailor-designed and made for cooper PCBs metallization by sputtering deposition technology.
Available sputtering targets: Nb, Ta, Au, Ag, Ti,Cr,Zr, Ni, Cu,
Graphite (C),SS316L etc
Everyone who is involved in PCB industry knows that PCBs which have copper finishes on the surface require a protective layer to protect it against oxidation and deterioration.
2 years ago, we received a request from our customer, they were looking for a coating solution which produces a fine gold and bronze colors on the copper PCBs which is used for 5G SIM card, social security cards and smart cards module. We spent 6 months in R&D, made over 20 experiments to finalize the proper coating processes. In March 2020, we delivered the machine to customer’s site with great satisfaction.
Prinited Circuit Boad, flexible electronics industry, 5G circuit microchip SIM card emblem isolated on white background
RTSP1200-PCB plating system can deposit the metals: Au gold, Ag silver, Cu copper conductive type of films; corrosion resistance type metals: Tantalum(Ta), Nickle (Ni), Chrome (Cr), SS316L etc. compounded films: carbon-based metal films, Nitride metal films.
PVD Gold Plating Advantages
Environmentally friendly process
Much lower production cost compared to conventional Gold electroplating
Excellent Life Span
Film thickness and uniformity are well controlled
Widely available, more options for end user
Key Features
Multiple deposition sources for fast deposition rate
Strong vacuum pumping system for a short cycle
Anode linear ion source to improve adhesion and high density of deposited films
6 units standard planar cathodes mounting flanges
Flexible coating processes applied
Modular structure design for fast exchange of cathodes and targets
Magnetron Sputtering System- Planar sputtering cathodes
Model: RTSP1200-PCB
Chamber Material: SUS304
Chamber Size: Φ1200*1500mm (H)
Deposition Technology: Magnetron sputtering
Targets: Nb, Ta, Au, Ag, Ti,Cr,Zr, Ni, Cu, Graphite (C),SS316L etc
Vacuum Pumps: Mechanical Pump: 1x300m3/hr
Holding Pump:1x60m3/hr
Roots Pump: 1x300L/S
Turbo Molecular pump: 2x3500L/S
Gas System: MFC for reactive gas and inert working gas
Protective System: HMI program with Multiple Self-Lock design
Operation & Control System: PLC + Touch Screen
Cooling System: Recycle Cooling water
Heating System: Heaters with PDI thermal couple
Max. Power Consumption 130KW Approx.
Average Power Consumption 70KW Approx.
Layout
Machine Model: RT1200-PCB
Technology: Magnetron Sputtering Deposition/ Ion Beam
Built Time: August 2020
Location: China