Tantalum is most widely used in the electronic industry and as a protective coating in many industries because of its good resistance to erosion.
Sputtered tantalum films are widely used in the below industries:
1. Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;
2. Medical instruments like body implants for its highly biocompatability property;
3. Coatings on corrosion resistant parts, such as thermowells, valve bodies, and fasteners;
Sputtered tantalum can be also be used as an effective corrosion resistance barrier if the coating is continuous, defected and is adherent to the substrate is intended to protect.
Recent interest in Tantalum deposition comes from two different applications. One is inmicroelectronicswhere thin tantalum films (<1μm) are used asdiffusion barrierlayers for copper interconnects.The other involves its application as a material forcorrosion and wear resistant coatingon surfaces that are subjected tohigh stresses and harsh chemical anderosiveenvironments.
Sputtered tantalum can be used as an effective corrosion resistance barrier if the coating is continuous, defect free and is adherent to the substrate it is intended to protect. Presently the useful life of various gun tubes is increased by protecting the internal gun tube surface with electro deposited chromium. Chromium may soon be replaced by tantalum in this application.
Though a highly expensive material used for special applications, since it has a high degree of ductility and malleability, almost any equipment design can be constructed from tantalum. Typical product examples are reactor vessel, columns, bayonet heaters, and tube condensers or heater exchangers, lined piping, valves, thermowells, spargers, rupture disks, glass repair kits, filaments for light bulbs, canalization for switches of liquid metals in nuclear reactors, surgical instruments and implants. Tantalum also has many applications in pharmaceutical plants. Tantalum products are preferred because theyresist corrosion and preserve product purity.- Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;
- Medical instruments like body implants for its highly biocompatability property;
- Coatings on corrosion resistant parts, such as thermowells, valve bodies, and fasteners;
- Sputtered tantalum can be also be used as an effective corrosion resistance barrier if the coating is continuous, defected and is adherent to the substrate is intended to protect.
- A standardized trolley is applied which allows easy and safe loading/unloading of the substrate holders and work pieces in/out of the deposition chamber
- The system is safety interlocked to prevent incorrect operation or unsafe practices
- The substrate heaters are provided which mounted in the center of chamber, PID controlled thermocouple for high accuracy, to enhance the condense film’s adhesion
- Strong vacuum pumps configurations with Magnetically suspension molecular pump via gate valve connected to chamber; backed with Leybold’s roots pump and two stage rotary vane pump, mechanical pump.
- High energy ionized plasma source is applied with this system to guarantee the uniformity and density.
Standardized Trolley with rack system Strong Vacuum Pump Configurations
Royal Technology’s standardized Tantalum sputtering deposition system: RTSP1000
| Main Configurations | |
| MODEL | RTSP1000-Ta |
| TECHNOLOGY |
Pulsed DC magnetron sputtering
Cathodic arc plating (for option, determined by coating process) |
| CHAMBER MATERIAL | Stainless Steel (S304) |
| CHAMBER SIZE | Φ1000*1600mm (H) |
| CHAMBER TYPE | D shape, cylindrical chamber |
| ROTATION RACK & JIG SYSTEM | Satellite driving or central driving system |
| POWER SUPPLIES |
DC Sputtering Power Supply: 2~4 sets Bias Power supply: 1 set Ion Source: 1 set |
| DEPOSITION MATERIAL | Ta, Ti/Cr/TiAl, Au, Ag, Cu etc. |
| DEPOSITION SOURCE | Planar Sputtering Cathodes + circular arc cathodes |
| CONTROL |
PLC(Programmable Logic Controller) + IPC ( manual+ auto+ semi-auto operation models) |
| PUMP SYSTEM | Rotary Vane Pump: SV300B – 1 set (Leybold) |
| Roots Pump: WAU1001 – 1 set (Leybold) | |
| Holding Pump: D60C – 1 set (Leybold) | |
|
Magnetic Suspension Molecular Pump: MAG2200 – 2 sest (Leybold) |
|
| GAS MASS FLOW CONTROLLER | 2 channels: Ar and N2 |
| VACUUM GAUGE | Inficon or Leybold |
| SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipmen |
| HEATING | Heaters: 20KW. Max. temp.: 450℃ |
| COOLING | Industrial Chiller (Cold Water) |
| POWER MAX. | 100KW (Approx.) |
| AVERAGE POWER CONSUMPTION | 45 KW (Approx.) |
| GROSS WEIGHT | T (Approx.) |
| FOOT PRINT | ( L*W*H) 4000*4000 *3600 MM |
| ELECTRICAL POWER | AC 380V/3 phases/50HZ / 5 line |
